Design, Fabrication and Performance Analysis of a Peltier Module-Based CPU Cooling System

Abstract

This project presents the design and implementation of a Design, Fabrication and Performance Analysis of a Peltier Module-Based CPU Cooling System combined with a water-cooled heat sink for efficient thermal management. Modern CPUs generate excessive heat during continuous operation, which can affect performance, stability, and lifespan. To solve this issue, a thermoelectric cooling method is used where the Peltier module transfers heat from the CPU surface to the cooling system based on the Peltier effect. One side of the Peltier cools the CPU, while the hot side is attached to a water cooled heat sink system to dissipate heat effectively without using any cooling fan. Water circulation through the heat sink helps in maintaining a stable and uniform temperature, improving overall heat removal efficiency. A temperature monitoring system is used to observe real-time CPU temperature and ensure safe operation. This setup provides a quiet, compact, and efficient cooling solution compared to traditional air-cooling systems. The main goal of this project is to maintain optimal CPU temperature, enhance system reliability, and prevent overheating issues in high performance computing applications.